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 05149
U0402FC3.3C
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. . . engineered solutions for the transient environmentTM
U0402FC36C
BIDIRECTIONAL UNBUMPED FLIP CHIP
APPLICA TIONS Cellular Phones MCM Boards Wireless Communication Circuits IR LEDs SMART Cards & PCMCIA Cards IEC COMPA TIBILITY (EN61000-4) 61000-4-2 (ESD): Air - 15kV, Contact - 8kV 61000-4-4 (EFT): 40A - 5/50ns FEA TURES ESD Protection > 25 kilovolts Available in Multiple Voltage Types Ranging From 3.3V to 36V 250 Watts Peak Pulse Power Dissipation per Line (8/20s) Monolithic Structure MECHANICAL CHARACTERISTICS Standard EIA Chip Size: 0402 Weight 0.73 milligrams (Approximate) Flammability Rating UL 94V-0 8mm Plastic & Paper Tape and Reel Per EIA Standard 481-1-A Device Marking On Reel
U0402
CIRCUIT DIAGRAM
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U0402FC36C
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25C Unless Otherwise Specified
PARAMETER Peak Pulse Power (tp = 8/20s) - See Figure 1 Operating Temperature Storage Temperature SYMBOL PPP TJ TSTG VALUE 250 -55C to 150C -55C to 150C UNITS Watts C C
ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified
PART NUMBER (See Note 1) RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM CLAMPING VOLTAGE (See Fig. 2) @ IP = 1A VC VOLTS 7.0 9.8 13.4 19.0 24.0 43.0 64.0 MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM LEAKAGE CURRENT TYPICAL CAPACITANCE
VWM VOLTS U0402FC3.3C U0402FC05C U0402FC08C U0402FC12C U0402FC15C U0402FC24C U0402FC36C 3.3 5.0 8.0 12.0 15.0 24.0 36.0
@ 1mA V(BR) VOLTS 4.0 6.0 8.5 13.3 16.7 26.7 40.0
@8/20s VC @ IPP 12.5V @ 20A 14.7V @ 17A 19.2V @ 13A 29.7V @ 9.0A 35.7V @ 7.0A 55.0V @ 5.0A 84.0V @ 3.0A
@VWM ID A 75 10 10 1 1 1 1
0V @ 1 MHz C pF 150 100 75 50 40 30 25
Note 1: All devices are bidirectional. Electrical characteristics apply in both directions.
FIGURE 1 PEAK PULSE POWER VS PULSE TIME
10,000
IPP - Peak Pulse Current - % of IPP PPP - Peak Pulse Current - Watts
120 100 80 60 40 20 0 tf
FIGURE 2 PULSE WAVE FORM
Peak Value IPP TEST WAVEFORM PARAMETERS tf = 8s td = 20s
1,000 250W, 8/20s Waveform
e-t
100
td = t I /2 PP 0 5 10 15 t - Time - s 20 25 30
10 0.01
1
10 td - Pulse Duration - s
100
1,000
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U0402FC36C
GRAPHS
FIGURE 3 POWER DERATING CURVE
Peak Pulse Power 8/20s 225C 5-10 sec 60 200C Instantaneous to 200C
100 80
% Of Rated Power
FIGURE 4 REFLOW SOLDER PROFILE
40 20 Average Power 0 0 25 50 75 100 125 TL - Lead Temperature - C 150 Pre-Heat Time Soldering Time Cool Down Time 100C 1-2 Minutes to 150C 1-2 Minutes to 25C
Note: This reflow profile does not take into account the printed circuit board (PCB) material heating time. Additional time may be required for the preheat time and cool down time upon the PCB or board material.
FIGURE 5 OVERSHOOT & CLAMPING VOLTAGE U0402FC05C
40
5 Volts per Division
30
20
10
0 ESD Test Pulse - 12 kilovolt, 1/30ns (waveshape)
14 12 10
FIGURE 6 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT U0402FC05C
VC - Clamping Voltage - Volts
8 6 4 2 0 0 5 10 IPP - Peak Pulse Current - Amps 15 20
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U0402FC36C
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
U0402
SIDE
TOP
PACKAGE DIMENSIONS
DIM A MILLIMETERS 0.46 NOM 0.86 NOM 0.99 0.0254 0.10 NOM 0.35 NOM 0.483 0.0254 0.406 NOM INCHES 0.018 NOM 0.034 NOM 0.039 0.001 0.004 NOM 0.014 NOM 0.019 0.001 0.016 NOM
A
C
B
E F Metalized Die Contacts
D
B C D E
END
I
F I
MOUNTING PAD
C B
D
PAD DIMENSIONS DIM Millimeters A B C D E F G H I 0.23 0.48 0.69 0.46 0.99 0.20 0.20 0.66 0.13 Inches 0.009 0.019 0.027 0.018 0.039 0.008 0.008 0.026 0.005
NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002"). 3. Maximum chip size: 1.02 (0.040") by 0.51(0.020").
A
T APE & REEL ORIENT TION A
SOLDER PAD
DIE CONTACTS
DIE
H
F
E
I
NOTE: Preferred: Using 0.1mm (0.004") stencil.
Single Die 0402
SOLDER PRINT DIAMETER 0.010" 0.012"
NOTE: 1. Top view of tape. Metal contacts are face down in tape package.
06020 Rev 2 - 2/02
G
TAPE & REEL PACKAGING: Surface mount product is taped and reeled in accordance with EIA-481, reel quantites and sizes are as follows: Paper Tape: 7 Inch Reel - 3,000 or 10,000 pieces per reel. Plastic Tape: 7 Inch Reel - 3,000 or 5,000 per reel.
COPYRIGHT (c) ProTek Devices 2001 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com
www.protekdevices.com
05149.R1 2/02
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